According to a research report published by Spherical Insights & Consulting, The Global Radiation Hardened Electronics Market Size is Expected to Grow from USD 1.62 Billion in 2023 to USD 2.57 Billion by 2033, at a CAGR of 4.72% during the forecast period 2023-2033.

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Radiation-hardened electronics are the electronic components, single-board computer CPUs, and sensors that are designed and produced to be less susceptible to damage exposure to radiation and extreme temperatures (-55°C to 125°C). The expanding applications of electronics in harsh environments such as nuclear power plants, oil and gas exploration, and high-energy physics investigations are the factors significantly responsible for driving the demand for radiation-hardened electronics. Numerous industries, including aerospace, defense, nuclear power plants, and healthcare, are witnessing new opportunities as a result of the focus on improving the performance, dependability, and affordability of these specialized components by continuous developments in materials research, design strategies, and testing procedures. The rising demand for satellite-based services, such as earth observation, communication, navigation, and other LEO space applications is driving the market. The ongoing advancement for improving the performance and reliability of radiation-hardened electronics is driving the market growth. However, the difficulty in creating an authentic testing environment is challenging the radiation-hardened electronics market. In addition, the high cost of production leads to limited adoption resulting in restraining the market growth.

Browse key industry insights spread across 255 pages with 121 Market data tables and figures & charts from the report on the Global Radiation Hardened Electronics Market Size, Share, and COVID-19 Impact Analysis, By Component (Integrated Circuits, Memory, Microcontrollers & Microprocessors, Power Management, and Others), By Technique (Rad-Hard by Design (RHBD), Rad-Hard By Process (RHBP), and Others), By Application (Space, Avionics & Defense, Nuclear Power Plants, Medical, and Others), and By Region (North America, Europe, Asia-Pacific, Latin America, Middle East, and Africa), Analysis and Forecast 2023 – 2033.

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The integrated circuits segment is anticipated to hold the largest market share during the forecast period.

Based on the components, the radiation hardened electronics market is classified into integrated circuits, memory, microcontrollers & microprocessors, power management, and others. Among these, the integrated circuits segment is anticipated to hold the largest market share during the forecast period. The widespread application of integrated circuits in space and defense for providing assistance in processing, communication, and control is driving the market growth in the integrated circuits segment.

The rad-hard by design (RHBD) segment accounted for the largest revenue share through the forecast period.

Based on the technique, the radiation hardened electronics market is classified into rad-hard by design (RHBD), rad-hard by process (RHBP), and others. Among these, the rad-hard by design (RHBD) segment accounted for the largest revenue share through the forecast period. Due to it providing superior performance, cost-effectiveness, and dependability, this method is favored over post-manufacturing hardening and is therefore perfect for mission-critical applications.

The space segment is anticipated to register the fastest CAGR growth during the forecast period.

Based on the application, the radiation hardened electronics market is classified into space, avionics & defense, nuclear power plants, medical, and others. Among these, the space segment is anticipated to register the fastest CAGR growth during the forecast period. The increasing number of space missions, satellite launches, and exploration operations are significantly contributing to driving the market in the space segment.

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North America is estimated to hold the largest share of the radiation hardened electronics market over the forecast period.

North America is estimated to hold the largest share of the radiation hardened electronics market over the forecast period. The increasing development of radiation-hardened electronics in the aerospace and defense sectors is driving the market in the region. Further, the presence of leading semiconductor production plants and research institutes for radiation hardened technologies are propelling the market growth.

Asia Pacific is predicted to have the highest CAGR growth in the radiation hardened electronics market over the forecast period. The growing number of commercial space projects is contributing to driving the market demand. Further, the growing semiconductor industry in the region is responsible for propelling the market growth. The increasing investment in product development by the manufacturers is propelling the market growth.

Competitive Analysis:

The report offers the appropriate analysis of the key organizations/companies involved within the radiation hardened electronics market along with a comparative evaluation primarily based on their type of offering, business overviews, geographic presence, enterprise strategies, segment market share, and SWOT analysis. The report also provides an elaborative analysis focusing on the current news and developments of the companies, which includes type development, innovations, joint ventures, partnerships, mergers & acquisitions, strategic alliances, and others. This allows for the evaluation of the overall competition within the market.

Major key players in the radiation hardened electronics market include Honeywell International, BAE Systems, Microchip Technology, Data Device Corporation, Texas Instruments, STMicroelectronics, Analog Devices, Advanced Micro Devices, Inc., Cobham Advanced Electronic Solutions, Teledyne Technologies, Infineon Technologies, Sandia National Laboratories, TTM Technologies Inc., Northrop Grumman Corporation, Renesas Electronics Corporation, and Others.

Key Target Audience

• Market Players
• Investors
• End-users
• Government Authorities
• Consulting And Research Firm
• Venture capitalists
• Value-Added Resellers (VARs)

Recent Development

• In July 2024, Moog Inc., a worldwide designer, manufacturer, and integrator of precision motion control components and systems, announces the development of its newest space computer to support the next generation of on-orbit computing needs.
• In June 2024, Infineon announced the availability of the industry’s first radiation-hardened (rad-hard) 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvolatile memory devices.
• In May 2024, Microchip Technology announced the SAMD21RT, a radiation-tolerant (RT) Arm Cortex-M0+ based 32-bit microcontroller (MCU) in a 64-pin ceramic and plastic package with 128 KB Flash and 16 KB SRAM.
• In April 2024, EPC Space LLC of Haverhill, MA, USA has launched the EPC7009L16SH, a radiation-hardened gallium nitride gate driver integrated circuit (IC) built on EPC’s proprietary eGaN IC technology. The EPC7009L16SH is suitable for power management where size, efficiency and simple design are critical.

Market Segment

This study forecasts revenue at global, regional, and country levels from 2023 to 2033. Spherical Insights has segmented the radiation hardened electronics market based on the below-mentioned segments:

Global Radiation Hardened Electronics Market, By Component

• Integrated Circuits
• Memory
• Microcontrollers & Microprocessors
• Power Management
• Others

Global Radiation Hardened Electronics Market, by Technique

• Rad-Hard by Design (RHBD)
• Rad-Hard by Process (RHBP)
• Others

Global Radiation Hardened Electronics Market, By Application

• Space
• Avionics & Defense
• Nuclear Power Plants
• Medical
• Others

Global Radiation Hardened Electronics Market, By Regional Analysis

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Rest of Asia Pacific
• South America
  • Brazil
  • Argentina
  • Rest of South America
• Middle East & Africa
  • UAE
  • Saudi Arabia
  • Qatar
  • South Africa
  • Rest of the Middle East & Africa

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